Chip Scale Packaging : Design, Materials Processes, Reliability, and Applications

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Language: Anglais
Cover of the book Chip Scale Packaging : Design, Materials Processes, Reliability, and Applications

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564 p. · 15.5x23.5 cm · Hardback
This book details the state of the art in Chip Scale Packaging (CSP)design and development, covering each major type of chip scale package developed by each major vendor, detailing the efficiency and cost effectiveness of different packages in varying applications.
Introduction. Chip scale package. AMKOR. Chip scale. EPS wirebond. EPS flip chip. Fujitsu. GE. Hitachi. Hitachi cable. IBM. LG semicon. Matsushita. Motorola (SLICC). Motorola CSP. National semiconductor. NEC flex substrate. NEC rigid substrate. Nitto Denko. Rohm. Sandia. Samsung. Sharp. Sony. T1. Tessera. Toshiba LOC. Toshiba rigid substrate. Shell castings.
Electrical & communications engineers, technicians & hobbyists