Fundamentals of Lead-Free Soldering Technology
From Microstructures to Reliability
Author: LEE Tae-kyuLanguage: Anglais
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The push towards lead-free soldering in computers, cell phones and other electronic and electrical devices has taken on a greater urgency as laws have been passed or are pending in the United States, the European Union and Asia which ban lead-bearing soldering. These new restrictions on hazardous substances are changing the way electronic devices are assembled, and specifically affect process engineering, manufacturing and quality assurance. Fundamentals of Lead-Free Soldering Technology provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.
Lead-Free Electronics.- Lead-Free Solder Alloys.- Physical and Mechanical Properties of Lead-Free Solders.- Implementation of Lead-Free Electronics.- Reliability of Lead-Free Solder Joints.- Tin Whiskering.- Electromigration in Lead-Free Solder Joints.- Emerging Technologies and Research.- Lead-Free Research and Lead-Free Products.
Provides an up-to-date overview on lead-free soldering technologies
Covers the fundamentals, implementation, reliability, challenges and risks of lead-free soldering techniques
Explores emerging technologies in lead-free soldering
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