Fundamentals of Lead-Free Solder Interconnect Technology, Softcover reprint of the original 1st ed. 2015
From Microstructures to Reliability

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Language: English

105.49 €

In Print (Delivery period: 15 days).

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Fundamentals of Lead-Free Solder Interconnect Technology
Publication date:
Support: Print on demand

Approximative price 105.49 €

In Print (Delivery period: 15 days).

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Fundamentals of Lead-Free Soldering Technology
Publication date:
253 p. · 15.5x23.5 cm · Hardback

This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.

Introduction.- Interconnection : The Joint.- Phase Equilibria and Microstructure of Sn-Ag-Cu Alloys.- Microstructure Development; Solidification and Isothermal Aging.- Thermal Cycling Performance.- Mechanical Stability and Performance.- Chemical and Environment Attack.- Challenges in Future Generation Interconnects: Microstructure Again.

Provides an up-to-date overview on lead-free soldering technologies Covers the fundamentals, implementation, reliability, challenges and risks of lead-free soldering techniques Explores emerging technologies in lead-free soldering Includes supplementary material: sn.pub/extras