Advanced copper-gold wire-stud interconnection technologies

Introduction to Semiconductor and Packaging Technologies, Conventional Au Wire Bonding, Conventional Au Stud Bumps, Cu Wire Bonding Problems, Ultrasonic Bonding Systems and Technologies of Cu Wire Bonding, Bonding Wire Metallurgy and Characteristics that Can Affect Bonding, Reliability, or Testing of Cu Wire Bonding, Process Technology Affecting Cu Wire Bonding, Cu Wire Bond Testing, Cu-Al Intermetallic Compounds and Other Metallic Interface Reactions in Cu Wire Bonding, The Effect of Plating, Bond Pad Technology and Reliability on Cu Wire Bonding, Cleaning to Improve Bondability and Reliability of Cu Wire Bonding, Mechanical Problems in Cu Wire Bonding, Advanced and Specialized Wire Bonding Technologies when using Cu Wire Bonding, Overview of Materials and Material Science of Cu/Low K Devices that Affect Cu Wire Bonding and Packaging, Overview of Process Modeling and Simulation on Cu Wire Bonding, Package Level Reliability of Cu Wire Bonded Device, Cu Stud Bonding