Packaging of High Power Semiconductor Lasers, Softcover reprint of the original 1st ed. 2015
Micro- and Opto-Electronic Materials, Structures, and Systems Series

Language: English

179.34 €

In Print (Delivery period: 15 days).

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Packaging of High Power Semiconductor Lasers
Publication date:
Support: Print on demand

179.34 €

In Print (Delivery period: 15 days).

Add to cartAdd to cart
Packaging of High Power Semiconductor Lasers
Publication date:
402 p. · 15.5x23.5 cm · Hardback
This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.

Introduction of High Power Semiconductor Lasers.- Overview of High Power Semiconductor Laser Packages.- Thermal Design and Management in High Power Semiconductor Laser Packaging.- Thermal Stress in High Power Semiconductor Lasers.- Optical Design and Beam Shaping in High Power Semiconductor Lasers.- Materials and Components in High Power Semiconductor Laser Packaging.- Packaging Process of High Power Semiconductor Lasers.- Testing and Characterization of High Power Semiconductor Lasers.- Failure Analysis and Reliability Assessment in High Power Semiconductor Laser Packaging.- Applications of High Power Semiconductor Lasers.- Development Trend and Challenges in High Power Semiconductor Laser Packaging.

Dr. Xingsheng Liu, Dr. Wei Zhao, Dr. Lingling Xiong, and Dr. Hui Liu are at the Xi’an Institute of Optics & Precision Mechanics, Chinese Academy of Sciences.
Describes packaging design for high power semiconductor lasers Details prevention techniques for thermal stress failures Discusses most recent technology trends in semiconductor laser packaging