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Search on Electronic Device Failure Analysis :

We found 106 books matching Electronic Device Failure Analysis .
You can narrow your results with filters : Only show books published in the last 5 years.

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  1. Author : SUHIR Ephraim
    Language: English
    04-2011
    The proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro– and opto–electronic structural...
    In Print (Delivery period: 12 days).
    Approximative price 197.45 € Add to cartAdd to cart
  2. Language: English
    11-2004500 p.21x27 cm
    This volume collects papers addressing the current state of the art in microelectronics testing and failure analysis. The coverage will be of practical value to anyone working to...
    Subject to availability at the publisher.
    Paperback Unknown price Add to cartAdd to cart
  3. Couverture de l'ouvrage Power Electronic Packaging
    Author : Liu Yong
    Language: English
    04-2014594 p.15.5x23.5 cm
    Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC...
    In Print (Delivery period: 15 days).
    Paperback 197.18 € Add to cartAdd to cart
  4. Couverture de l'ouvrage Power electronic packaging
    Author : Liu Yong
    Language: English
    02-201215.5x23.5 cm
    Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC...
    In Print (Delivery period: 15 days).
    Paperback 232.09 € Add to cartAdd to cart
  5. Couverture de l'ouvrage Electronic thin film reliability
    Author : Tu King-Ning
    Language: English
    11-2010500 p.18x25.4 cm
    Thin films are widely used in the electronic device industry. As the trend for miniaturization of electronic devices moves into the nanoscale domain, the reliability of...
    In Print (Delivery period: 14 days).
    Hardback 69.51 € Add to cartAdd to cart
  6. Couverture de l'ouvrage Wafer-Level Chip-Scale Packaging
    Authors : Qu Shichun , Liu Yong
    Language: English
    08-2016Print on demand322 p.15.5x23.5 cm
    Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent...
    In Print (Delivery period: 15 days).
    Paperback 98.58 € Add to cartAdd to cart
  7. Couverture de l'ouvrage Wafer-Level Chip-Scale Packaging
    Authors : Qu Shichun , Liu Yong
    Language: English
    09-2014322 p.15.5x23.5 cm
    Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent...
    In Print (Delivery period: 15 days).
    Hardback 137.14 € Add to cartAdd to cart
  8. Couverture de l'ouvrage Failure analysis: a practical guide for manufacturers of electronic components and systems (Quality and reliability engineering series)
    Authors : Bazu Marius , Bajenescu Titu
    Language: English
    04-2011340 p.17.8x24.9 cm
    Failure analysis is the preferred method to investigate product or process reliability and to ensure optimum performance of electrical components and systems. The...
    In Print (Delivery period: 12 days).
    Hardback Approximative price 111.61 € Add to cartAdd to cart
  9. Authors : BAZU Marius, BAJENESCU Titu
    Language: English
    04-2011
    Failure analysis is the preferred method to investigate product or process reliability and to ensure optimum performance of electrical components and systems. The...
    In Print (Delivery period: 12 days).
    Paperback Approximative price 116.37 € Add to cartAdd to cart
  10. Couverture de l'ouvrage Semiconductor device reliability (Procds of the NATO advanced study..held in Heraklion,Crete, June 4/9, 1989, Volume 175)
    Language: English
    10-2011575 p.15.5x23.5 cm
    This publication is a compilation of papers presented at the Semiconductor Device Reliabi­ lity Workshop sponsored by the NATO International Scientific Exchange Program. The Workshop was...
    In Print (Delivery period: 15 days).
    Paperback 348.14 € Add to cartAdd to cart
  11. Couverture de l'ouvrage Semiconductor device reliability (Procds of the NATO advanced study..held in Heraklion,Crete, June 4/9, 1989, Volume 175)
    Language: English
    01-1990576 p.
    This publication is a compilation of papers presented at the Semiconductor Device Reliabi­ lity Workshop sponsored by the NATO International Scientific Exchange Program. The Workshop was...
    Subject to availability at the publisher.
    Hardback Approximative price 411.45 € Add to cartAdd to cart
  12. Couverture de l'ouvrage Design reliability
    Author : Dhillon B.S.
    Language: English
    06-1999480 p.15.6x23.4 cm
    As engineering systems become more and more complex, industry has recognized the importance of system and product reliability and places ever increasing emphasis on it during the design phase...
    Subject to availability at the publisher.
    Hardback Approximative price 143.14 € Add to cartAdd to cart
  13. Couverture de l'ouvrage Structural dynamics of electronic and photonic systems (hardback)
    Language: English
    05-2011608 p.20.1x24.4 cm
    The all-in-one reference on the methods and techniques for solving shock and vibration issues in portable electronic systemsThis comprehensive exploration of structural dynamics offers...
    In Print (Delivery period: 12 days).
    Hardback Approximative price 198.80 € Add to cartAdd to cart
  14. Couverture de l'ouvrage Electrical Overstress (EOS)
    Author : Voldman Steven H.
    Language: English
    10-2013344 p.17x25.1 cm
    Electrical Overstress (EOS) continues to impact semiconductor manufacturing, semiconductor components and systems as technologies scale from micro– to nano–electronics. , This bookteaches the...
    In Print (Delivery period: 12 days).
    Hardback Approximative price 102.68 € Add to cartAdd to cart
  15. Author : Jamnia Ali
    Language: English
    07-201615.6x23.5 cm
    Successfully Estimate the Thermal and Mechanical Characteristics of Electronics Systems. A definitive guide for practitioners new to the field or requiring a refresher course, Practical Guide to...
    In Print (Delivery period: 13 days).
    Hardback Approximative price 133.47 € Add to cartAdd to cart
  16. Couverture de l'ouvrage Rural Technology Development and Delivery
    Language: English
    04-2019Print on demand357 p.15.5x23.5 cm
    This book comprises the proceedings of a rural technologies conference organised by the Rural Technology Action Group (RuTAG), which was conceptualized and initiated by Principal Scientific...
    In Print (Delivery period: 15 days).
    Hardback 179.34 € Add to cartAdd to cart
  17. Couverture de l'ouvrage Airborne Electronic Hardware Design Assurance
    Authors : Fulton Randall , Vandermolen Roy
    Language: English
    12-2014226 p.15.6x23.4 cm
    Written by a Federal Aviation Administration (FAA) consultant designated engineering representative (DER) and an electronics hardware design engineer who together taught the DO-254 class at the...
    In Print (Delivery period: 13 days).
    Hardback Approximative price 90.46 € Add to cartAdd to cart
  18. Language: English
    10-2003336 p.
    Presents the Austrian school of thought and its response to the "internet economy", with contributions are from such figures as Peter Boettke, Richard Arena and the late Don Lavoie. It offers a...
    Subject to availability at the publisher.
    Hardback Approximative price 181.72 € Add to cartAdd to cart
  19. Couverture de l'ouvrage Practical electronic reliability engineering : getting the job done from requirement through acceptance
    Author : Klion Jerome
    Language: English
    03-2012601 p.15.2x22.9 cm
    This book is intended for the engineer or engineering student with little or no prior background in reliability. Its purpose is to provide the background material and guidance necessary to...
    In Print (Delivery period: 15 days).
    Paperback 168.79 € Add to cartAdd to cart
  20. Author : Klion Jerome
    Language: English
    08-1992
    This book is intended for the engineer or engineering student with little or no prior background in reliability. Its purpose is to provide the background material and guidance necessary to...
    Subject to availability at the publisher.
    Hardback Approximative price 169.06 € Add to cartAdd to cart
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