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Search on IC Failure Analysis :

We found 82 books matching IC Failure Analysis . You can narrow your results with filters.

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  1. Language: English
    300 p.
    Failure analysis and reliability improvement are linked for improvement of microcircuits packaging by these technical papers. Design factors such as oxide reliability...
    Subject to availability at the publisher.
    Approximative price 149.15 € Add to cartAdd to cart
  2. Couverture de l'ouvrage Failure-free integrated circuit packages
    Authors : COHN C., HARPER Charles A.
    Language: English
    09-200415x23 cm
    Driven by the fast-growing market for personal electronic devices, integrated circuit complexity has increased as feature sizes shrink. The resulting integrated circuit devices are prone to more...
    Subject to availability at the publisher.
    Hardback 83.62 € Add to cartAdd to cart
  3. Author : AMERASEKERA E. Ajith
    Language: English
    04-2002
    Esd in Silicon Integrated Circuits Ajith Amerasekera Charvaka Duvvury Texas Instruments Inc, Dallas, USA Electrostatic Discharge (ESD) effects in silicon integrated circuits have become a major...
    Stock outage
    Approximative price 210.36 € Add to cartAdd to cart
  4. Couverture de l'ouvrage Failure analysis of integrated circuits tools & techniques (Kluwer intl series in engineering & computer science 494)
    Language: English
    11-2012255 p.15.5x23.5 cm
    This book provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in...
    In Print (Delivery period: 15 days).
    Paperback 147.69 € Add to cartAdd to cart
  5. Couverture de l'ouvrage Failure analysis of integrated circuits tools & techniques (Kluwer intl series in engineering & computer science 494)
    Language: English
    01-1999216 p.
    This book provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in...
    Subject to availability at the publisher.
    Hardback Approximative price 200.40 € Add to cartAdd to cart
  6. Author : WANG Albert Z.H.
    Language: English
    06-2002
    This comprehensive and insightful book discusses ESD protection circuit design problems from an IC designer's perspective. On-Chip ESD Protection for Integrated Circuits: An IC...
    Subject to availability at the publisher.
    Paperback Approximative price 80.20 € Add to cartAdd to cart
  7. Language: English
    09-2018Print on demand611 p.17.8x25.4 cm
    This textbook provides a comprehensive, fully-updated introduction to the essentials of nanometer CMOS integrated circuits.  It includes aspects of scaling to even beyond 12nm CMOS technologies...
    In Print (Delivery period: 15 days).
    Paperback 105.49 € Add to cartAdd to cart
  8. Couverture de l'ouvrage Nanometer CMOS ICs
    Language: English
    05-2017Print on demand611 p.17.8x25.4 cm
    This textbook provides a comprehensive, fully-updated introduction to the essentials of nanometer CMOS integrated circuits.  It includes aspects of scaling to even beyond 12nm CMOS technologies...
    In Print (Delivery period: 15 days).
    Hardback 105.49 € Add to cartAdd to cart
  9. Couverture de l'ouvrage From contamination to defects, faults and yeild loss : simulation & applications(frontiers in electronic testing/5)
    Authors : Khare Jitendra B. , Maly Wojciech
    Language: English
    09-2011150 p.15.5x23.5 cm
    Introduction. Background. Contamination-defect-fault (CDF) simulation. CDF mapper CODEF. CODEF applications. Possible extensions. Conclusions.
    In Print (Delivery period: 15 days).
    Paperback 105.49 € Add to cartAdd to cart
  10. Couverture de l'ouvrage From contamination to defects, faults and yeild loss : simulation & applications(frontiers in electronic testing/5)
    Authors : Khare Jitendra B. , Maly Wojciech
    Language: English
    04-1996168 p.
    Introduction. Background. Contamination-defect-fault (CDF) simulation. CDF mapper CODEF. CODEF applications. Possible extensions. Conclusions.
    Subject to availability at the publisher.
    Hardback Approximative price 168.79 € Add to cartAdd to cart
  11. Couverture de l'ouvrage Moisture Sensitivity of Plastic Packages of IC Devices
    Language: English
    07-2010558 p.15.5x23.5 cm
    Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most...
    In Print (Delivery period: 15 days).
    Hardback Approximative price 242.64 € Add to cartAdd to cart
  12. Couverture de l'ouvrage New directions in failure to thrive
    Language: English
    03-2012384 p.17x24.4 cm
    Failure to thrive affects the lives of many infants and young children at critical times in their development and represents a significant public health problem in the United States...
    In Print (Delivery period: 15 days).
    Paperback Approximative price 91.77 € Add to cartAdd to cart
  13. Couverture de l'ouvrage New directions in failure to thrive
    Language: English
    02-1986398 p.
    Failure to thrive affects the lives of many infants and young children at critical times in their development and represents a significant public health problem in the United States...
    Subject to availability at the publisher.
    Hardback Approximative price 140.17 € Add to cartAdd to cart
  14. Couverture de l'ouvrage Power electronic packaging
    Author : Liu Yong
    Language: English
    04-2014594 p.15.5x23.5 cm
    Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication...
    In Print (Delivery period: 15 days).
    Paperback Approximative price 197.18 € Add to cartAdd to cart
  15. Couverture de l'ouvrage Power Electronic Packaging
    Author : Liu Yong
    Language: English
    02-201215.5x23.5 cm
    Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication...
    In Print (Delivery period: 15 days).
    Paperback Approximative price 232.09 € Add to cartAdd to cart
  16. Author : SEGURA Jaume
    Language: English
    01-2005
    CMOS manufacturing environments are surrounded with symptoms that can indicate serious test, design, or reliability problems, which, in turn, can affect the financial as well as the engineering...
    In Print (Delivery period: 12 days).
    Approximative price 160.18 € Add to cartAdd to cart
  17. Couverture de l'ouvrage CMOS : Electronics, how it works, how it fails
    Authors : Segura Jaume , Hawkins Charles F.
    Language: English
    04-2004360 p.18.7x26.1 cm
    CMOS manufacturing environments are surrounded with symptoms that can indicate serious test, design, or reliability problems, which, in turn, can affect the financial as well as the engineering...
    Subject to availability at the publisher.
    Hardback Approximative price 166.46 € Add to cartAdd to cart
  18. Couverture de l'ouvrage Esd - circuits and devices
    Author : HOWARD Steven
    Language: English
    11-2005456 p.
    The scaling of semiconductor devices from sub-micron to nanometer dimensions is driving the need for understanding the design of electrostatic discharge (ESD) circuits, and the response of these...
    In Print (Delivery period: 12 days).
    Hardback Approximative price 124.45 € Add to cartAdd to cart
  19. Couverture de l'ouvrage High-speed VLSI interconnections
    Author : Goel Ashok K.
    Language: English
    10-2007408 p.15.5x24.2 cm
    Updated to reflect the major developments in field of VLSI interconnections over the past decade, this Second Edition of High-Speed VLSI Interconnections includes new sections on Parasitic...
    In Print (Delivery period: 12 days).
    Hardback Approximative price 198.80 € Add to cartAdd to cart
  20. Couverture de l'ouvrage Semiconductor device reliability (Procds of the NATO advanced study..held in Heraklion,Crete, June 4/9, 1989, Volume 175)
    Language: English
    10-2011575 p.15.5x23.5 cm
    This publication is a compilation of papers presented at the Semiconductor Device Reliabi­ lity Workshop sponsored by the NATO International Scientific Exchange Program. The Workshop was held in...
    In Print (Delivery period: 15 days).
    Paperback 348.14 € Add to cartAdd to cart
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