Description
Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore
Woodhead Publishing Series in Electronic and Optical Materials Series
Authors: Zhang Hengyun, Che Faxing, Lin Tingyu, Zhao Wensheng
Language: EnglishSubjects for Modeling, Analysis, Design, and Tests for Electronics...:
226.07 €
In Print (Delivery period: 14 days).
Add to cart the book of Zhang Hengyun, Che Faxing, Lin Tingyu, Zhao Wensheng434 p. · 15x22.8 cm · Paperback
Description
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Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included.
2. Electrical modeling and design
3. Thermal modeling, analysis, and design
4. Stress and reliability analysis for interconnects
5. Reliability and failure analysis of encapsulated packages
6. Thermal and mechanical tests for packages and materials
7. System-level modeling, analysis, and design
Dr. Faxing Che is a scientist with the Institute of Microelectronics (IME), Agency for Science, Technology and Research (A-star), Singapore. He has 13-years’ experience in the design-for-reliability for advanced electronics packaging. He was a Senior R&D Engineer with the United Test and Assembly Centre and ST Microelectronics for three years, and a Staff Engineer with Infineon Technologies Singapore for two years. He has authored and co-authored more than 120 technical papers in refereed journals and conferences. His current research interests include design for reliability in wafer-level, chip scale packaging, and 3-D advanced packaging, Cu wire bonding, Fan-out WLP, finite-element modeling and characterization of microelectronics packaging materials.
Dr. Tingyu Lin is a technical Director of National Centre for Advanced Packaging (NCAP), China. He has more than 20-year experiences in design, process, assembly, reliability and equipment development in electronics packaging, semiconductor, consumer electronics, thermal and aerospace industry. Before joining NCAP, he was a Motorola (Google) certified Six Sigma Black Belt in 2012. F
- Includes advanced modeling and analysis methods and techniques for state-of-the art electronics packaging
- Features experimental characterization and qualifications for the analysis and verification of electronic packaging design
- Provides multiphysics modeling and analysis techniques of electronic packaging