Description
Advanced Thermal Management Materials, 2013
Language: EnglishSubjects for Advanced Thermal Management Materials:
Publication date: 10-2014
156 p. · 15.5x23.5 cm · Paperback
156 p. · 15.5x23.5 cm · Hardback
Description
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Introduction to Thermal Management in Microelectronics Packaging.- Requirements of Thermal Management Materials.- Overview of Traditional Thermal Management Materials.-Development of Advanced Thermal Management Materials.- Properties of WCu, MoCu, Cu/MoCu/Cu High Performance Heat Sink Materials and Manufacturing Technologies.- Novel Methods for Manufacturing of W85-Cu Heat Sinks for Electronic Packaging Applications.- Improved Manufacturing Process of Cu/Mo70-Cu/Cu Composite Heat Sinks for Electronic Packaging Applications.- Al/SiC Thermal Management Materials.- Understanding of Laser, Laser diodes, Laser diode packaging and its relationship to Tungsten Copper.- Future Trend of Advanced Thermal Management Materials.