Hot Carrier Degradation in Semiconductor Devices, Softcover reprint of the original 1st ed. 2015

Coordinator: Grasser Tibor

Language: English

118.31 €

In Print (Delivery period: 15 days).

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Hot Carrier Degradation in Semiconductor Devices
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Support: Print on demand

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Hot Carrier Degradation in Semiconductor Devices
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517 p. · 15.5x23.5 cm · Hardback

This book provides readers with a variety of tools to address the challenges posed by hot carrier degradation, one of today?s most complicated reliability issues in semiconductor devices.  Coverage includes an explanation of carrier transport within devices and book-keeping of how they acquire energy (?become hot?), interaction of an ensemble of colder and hotter carriers with defect precursors, which eventually leads to the creation of a defect, and a description of how these defects interact with the device, degrading its performance. 

Part I: Beyond Lucky Electrons.- From Atoms to Circuits: Theoretical and Empirical Modeling of Hot Carrier Degradation.- The Energy Driven Hot Carrier Model.- Hot-Carrier Degradation in Decananometer.- Physics-based Modeling of Hot-carrier Degradation.- The Spherical Harmonics Expansion Method for Assessing Hot Carrier Degradation.- Recovery from Hot Carrier Induced Degradation Through Temperature Treatment.- Characterization of MOSFET Interface States Using the Charge Pumping Technique.- Part II: CMOS and Beyond.- Channel Hot Carriers in SiGe and Ge pMOSFETs.- Channel Hot Carrier Degradation and Self-Heating Effects in FinFETs.- Characterization and Modeling of High-Voltage LDMOS Transistors.- Compact modelling of the Hot-carrier Degradation of Integrated HV MOSFETs.- Hot-Carrier Degradation in Silicon-Germanium Heterojunction Bipolar Transistors.
Tibor Grasser is an Associate Professor at the Institute for Microelectronics for Technische Universität Wien.
Describes the intricacies of hot carrier degradation in modern semiconductor technologies Covers the entire hot carrier degradation phenomenon, including topics such as characterization, carrier transport, carrier-defect interaction, technological impact, circuit impact, etc Enables detailed understanding of carrier transport, interaction of the carrier ensemble with the defect precursors, and an accurate assessment of how the newly created defects impact the device performance Covers modeling issues starting from detailed physics-based TCAD approaches up to efficient SPICE-compatible compact models Includes supplementary material: sn.pub/extras